Items | Mass Production Capabilities | Prototyping Capabilities |
Layers | 2 - 32 L | 2 - 20 L |
Board thickness | 0.35-6.0mm | 0.35-5.0mm |
Flexible thickness | 0.06-0.5mm | 0.07-0.5mm |
Minimum line width | 0.05mm | 0.075mm |
Minimum space | 0.05mm | 0.075mm |
Impedance control tolerance | ± 10 % | ± 10 % |
Special impedance tolerance | ± 3 % | ± 3 % |
Flexible minimum width | 4mil | 5mil |
Maximum size | 480 - 1000mm | |
Outer copper thickness | 6 oz | |
Inner copper thickness | 3 oz | |
Mechanical minimum aperture | 0.1mm | |
Laser minimum aperture | 0.075mm | |
Maximum thickness to diameter ratio | 11:1 | |
Hole distance to the conductor | Below 8 Layer 6mil；10 Layer 8mil；More than 12 Layer 10mil | |
HDI type | 1+n+1；2+n+2 | |
Rigid PCB | Sheng Yi, Hong Ren, Lian MAO, Lian Zhi | |
Flexible plate | Shengyi, Dupont, Panasonic, Taihong, Xinyang | |
Material type | FR4, Electrolytic Copper, Calendered Copper, PET, PI (Polyimide) | |
Reinforcement type | PI，PET，FR4，SUS，PSA | |
Surface finish | Gold, silver, gold, soft gold, nickel, palladium, tin, oxidation resistance, tin spray | |
Process varieties | Rigid flex PCB, FPC PCB, Sidestep PCB, High Tg PCB, Via In Pad PCB and other special technology. | |
Rigid Flex PCB Production Time | ||
Layers | Quick Turn (days) | Normal period (days) |
2L | 6 | 14 |
4L | 6 | 15 |
6L | 7 | 15 |
8L | 8 | 16 |
10L | 9 | 18 |
≥12L | RFQ | |